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Image Product Number Pricing(USD) Quantity ECAD Quantity Available Weight(Kg) Mfr Series Package Product Status Operating Temperature Mounting Type Type Features Base Product Number Accessory Type Color For Use With/Related Products Termination DataSheet RoHS Status Moisture Sensitivity Level (MSL) REACH Status ECCN HTSUS Standard Package Connector Type Pitch Number of Rows Row Spacing Contact Finish Contact Finish Thickness Current Rating (Amps) Housing Material Material Flammability Rating Contact Type Pitch - Mating Number of Positions Contact Finish - Mating Contact Finish Thickness - Mating Contact Finish - Post Contact Finish Thickness - Post Convert From (Adapter End) Convert To (Adapter End) Number of Pins Number of Positions or Pins (Grid) Contact Material - Mating Pitch - Post Contact Material - Post Termination Post Length Contact Resistance Board Material
32-652000-10-P Aries Electronics 32-652000-10-P -
RFQ
ECAD 9015 0.00000000 Aries Electronics Correct-A-Chip® 652000 Bulk Discontinued at SIC - Through Hole - 32-6520 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 15 1 A - - 0.050" (1.27mm) - - Tin-Lead 200.0µin (5.08µm) PLCC DIP, 0.6" (15.24mm) Row Spacing 32 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
28-3518-11H Aries Electronics 28-3518-11H 9.5263
RFQ
ECAD 8110 0.00000000 Aries Electronics 518 Bulk Active - Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame 28-3518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 14 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
06-658-10 Aries Electronics 06-658-10 0.5303
RFQ
ECAD 3113 0.00000000 Aries Electronics 658 Bulk Active Top Slot 06-658 Cap (Cover) 680 Series download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 6
04-6625-21 Aries Electronics 04-6625-21 1.8559
RFQ
ECAD 9102 0.00000000 Aries Electronics 625 Bulk Active Through Hole - 04-6625 Black Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 DIP, DIL - Header 0.100" (2.54mm) 2 0.600" (15.24mm) Gold 10.0µin (0.25µm) Post 4
10-9513-10 Aries Electronics 10-9513-10 2.9492
RFQ
ECAD 1977 0.00000000 Aries Electronics Lo-PRO®file, 513 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.9" (22.86mm) Row Spacing Closed Frame 10-9513 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 10 (2 x 5) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
16-3518-101 Aries Electronics 16-3518-101 3.7572
RFQ
ECAD 6908 0.00000000 Aries Electronics 518 Bulk Active - Through Hole DIP, 0.3" (7.62mm) Row Spacing Open Frame 16-3518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 16 (2 x 8) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
36-6556-30 Aries Electronics 36-6556-30 15.9939
RFQ
ECAD 5597 0.00000000 Aries Electronics 6556 Bulk Active - Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame 36-6556 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 36 (2 x 18) Beryllium Copper 0.100" (2.54mm) Brass 0.423" (10.74mm) -
04-0503-30 Aries Electronics 04-0503-30 1.8231
RFQ
ECAD 4668 0.00000000 Aries Electronics 0503 Bulk Active - Through Hole SIP - 04-0503 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA), Nylon, Glass Filled UL94 HB 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 4 (1 x 4) Beryllium Copper 0.100" (2.54mm) Brass 0.500" (12.70mm) -
19-0501-30 Aries Electronics 19-0501-30 10.9626
RFQ
ECAD 5464 0.00000000 Aries Electronics 501 Bulk Active -55°C ~ 105°C Through Hole SIP - 19-0501 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 19 (1 x 19) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.690" (17.52mm) -
18-8470-610C Aries Electronics 18-8470-610C 11.6535
RFQ
ECAD 6738 0.00000000 Aries Electronics 8 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame, Elevated 18-8470 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 18 (2 x 9) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
1109800-16 Aries Electronics 1109800-16 -
RFQ
ECAD 9181 0.00000000 Aries Electronics Correct-A-Chip® 1109800 Bulk Active - Through Hole DIP, 0.3" (7.62mm) Row Spacing Programmable 1109800 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 200.0µin (5.08µm) 16 (2 x 8) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
18-8375-310C Aries Electronics 18-8375-310C 11.4353
RFQ
ECAD 6185 0.00000000 Aries Electronics 8 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Closed Frame, Elevated 18-8375 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 18 (2 x 9) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
28-6556-30 Aries Electronics 28-6556-30 13.7463
RFQ
ECAD 6669 0.00000000 Aries Electronics 6556 Bulk Active - Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame 28-6556 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 28 (2 x 14) Beryllium Copper 0.100" (2.54mm) Brass 0.423" (10.74mm) -
16-81100-310C Aries Electronics 16-81100-310C 10.0717
RFQ
ECAD 1356 0.00000000 Aries Electronics 8 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Closed Frame, Elevated 16-8110 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 16 (2 x 8) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
05-0501-20 Aries Electronics 05-0501-20 6.6458
RFQ
ECAD 3863 0.00000000 Aries Electronics 501 Bulk Active -55°C ~ 105°C Through Hole SIP - 05-0501 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 5 (1 x 5) Phosphor Bronze 0.100" (2.54mm) Phosphor Bronze 0.420" (10.67mm) -
48-6518-01 Aries Electronics 48-6518-01 16.0286
RFQ
ECAD 8422 0.00000000 Aries Electronics 518 Bulk Active - Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame 48-6518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 48 (2 x 24) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
44-6574-11 Aries Electronics 44-6574-11 32.6262
RFQ
ECAD 8747 0.00000000 Aries Electronics 57 Bulk Active - Through Hole DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Closed Frame 44-6574 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Tin 200.0µin (5.08µm) Tin 200.0µin (5.08µm) 44 (2 x 22) Beryllium Copper 0.100" (2.54mm) Beryllium Copper 0.110" (2.78mm) -
08-665000-00 Aries Electronics 08-665000-00 16.7954
RFQ
ECAD 3246 0.00000000 Aries Electronics Correct-A-Chip® 665000 Bulk Active - Surface Mount - 08-6650 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - 0.050" (1.27mm) - - Tin-Lead 200.0µin (5.08µm) SOIC-W SOIC 8 - 0.050" (1.27mm) Brass 0.031" (0.80mm) FR4 Epoxy Glass
1109523 Aries Electronics 1109523 13.8200
RFQ
ECAD 31 0.00000000 Aries Electronics Correct-A-Chip® 1109523 Bulk Active - Through Hole Socket Included 1109523 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin-Lead 200.0µin (5.08µm) DIP, 0.3" (7.62mm) Row Spacing JEDEC 8 Beryllium Copper - Brass 0.125" (3.18mm) FR4 Epoxy Glass
08-666000-00 Aries Electronics 08-666000-00 13.9379
RFQ
ECAD 1912 0.00000000 Aries Electronics Correct-A-Chip® 666000 Bulk Active - Surface Mount - 08-6660 Solder download RoHS non-compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 - - 0.050" (1.27mm) - - Tin-Lead 200.0µin (5.08µm) SOIC SOWIC 8 - 0.050" (1.27mm) Brass 0.080" (2.03mm) FR4 Epoxy Glass
24-8770-310C Aries Electronics 24-8770-310C 14.1819
RFQ
ECAD 4939 0.00000000 Aries Electronics 8 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.3" (7.62mm) Row Spacing Closed Frame, Elevated 24-8770 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 24 (2 x 12) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
60-9503-30 Aries Electronics 60-9503-30 22.7761
RFQ
ECAD 7060 0.00000000 Aries Electronics 503 Bulk Active -55°C ~ 105°C Through Hole DIP, 0.9" (22.86mm) Row Spacing Closed Frame 60-9503 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 60 (2 x 30) Beryllium Copper 0.100" (2.54mm) Phosphor Bronze 0.500" (12.70mm) -
22-3625-51 Aries Electronics 22-3625-51 21.8921
RFQ
ECAD 5604 0.00000000 Aries Electronics 625 Bulk Active Through Hole - 22-3625 Black Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 DIP, DIL - Header 0.100" (2.54mm) 2 0.300" (7.62mm) Gold 10.0µin (0.25µm) Forked 22
44-652000-11-RC Aries Electronics 44-652000-11-RC 52.3167
RFQ
ECAD 7199 0.00000000 Aries Electronics Correct-A-Chip® 652000 Bulk Active - Through Hole - 44-6520 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 1 A - - 0.050" (1.27mm) - - Gold 10.0µin (0.25µm) PLCC DIP, 0.6" (15.24mm) Row Spacing 44 - 0.100" (2.54mm) Brass 0.125" (3.18mm) FR4 Epoxy Glass
1106396-28 Aries Electronics 1106396-28 15.2900
RFQ
ECAD 5950 0.00000000 Aries Electronics Correct-A-Chip® 1106396 Bulk Active - Through Hole - 1106396 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) DIP, 0.3" (7.62mm) Row Spacing DIP, 0.6" (15.24mm) Row Spacing 28 Beryllium Copper 0.100" (2.54mm) Brass 0.130" (3.30mm) -
36-6556-21 Aries Electronics 36-6556-21 25.7538
RFQ
ECAD 4302 0.00000000 Aries Electronics 6556 Bulk Active - Through Hole DIP, 0.6" (15.24mm) Row Spacing Open Frame 36-6556 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyphenylene Sulfide (PPS), Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 36 (2 x 18) Beryllium Copper 0.100" (2.54mm) Brass 0.283" (7.19mm) -
22-6503-21 Aries Electronics 22-6503-21 17.0565
RFQ
ECAD 7685 0.00000000 Aries Electronics 503 Bulk Active -55°C ~ 125°C Through Hole DIP, 0.6" (15.24mm) Row Spacing Closed Frame 22-650 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Gold 10.0µin (0.25µm) 22 (2 x 11) Beryllium Copper 0.100" (2.54mm) Phosphor Bronze 0.360" (9.14mm) -
12-823-90C Aries Electronics 12-823-90C 9.3200
RFQ
ECAD 5893 0.00000000 Aries Electronics Vertisockets™ 800 Bulk Active -55°C ~ 105°C Through Hole, Right Angle, Horizontal DIP, 0.3" (7.62mm) Row Spacing Closed Frame 12-823 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 30.0µin (0.76µm) Tin 200.0µin (5.08µm) 12 (2 x 6) Beryllium Copper 0.100" (2.54mm) Brass 0.140" (3.56mm) -
11-0503-21 Aries Electronics 11-0503-21 8.2709
RFQ
ECAD 9594 0.00000000 Aries Electronics 0503 Bulk Active - Through Hole SIP - 11-0503 Wire Wrap download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA), Nylon, Glass Filled UL94 HB 0.100" (2.54mm) Gold 30.0µin (0.76µm) Gold 10.0µin (0.25µm) 11 (1 x 11) Beryllium Copper 0.100" (2.54mm) Brass 0.360" (9.14mm) -
25-0518-10T Aries Electronics 25-0518-10T 2.5856
RFQ
ECAD 9439 0.00000000 Aries Electronics 518 Bulk Active - Through Hole SIP Open Frame 25-0518 Solder download ROHS3 Compliant 1 (Unlimited) REACH Unaffected EAR99 8536.69.4040 1 3 A Polyamide (PA46), Nylon 4/6, Glass Filled UL94 V-0 0.100" (2.54mm) Gold 10.0µin (0.25µm) Tin 200.0µin (5.08µm) 25 (1 x 25) Beryllium Copper 0.100" (2.54mm) Brass 0.125" (3.18mm) -
  • Daily average RFQ Volume

    2000+

    Daily average RFQ Volume

  • Standard Product Unit

    30,000,000

    Standard Product Unit

  • Worldwide Manufacturers

    2800+

    Worldwide Manufacturers

  • In-stock Warehouse

    15,000 m2

    In-stock Warehouse