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Email: sales@sic-components.com
Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Type | Base Product Number | Weight | Shelf Life | Shelf Life Start | Storage/Refrigeration Temperature | Shipping Info | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Composition | Form | Diameter | Melting Point | Flux Type | Wire Gauge | Process | SIC Storage | Mesh Type |
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SMD291AX250T3 | 41.9500 | ![]() |
3453 | 0.00000000 | Chip Quik Inc. | - | Jar | Active | Solder Paste | SMD291 | 0.551 lb (249.93 g) | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Sn63Pb37 (63/37) | Jar, 8.8 oz (250g) | - | 361°F (183°C) | No-Clean | - | Leaded | Refrigerated | 3 | ||
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MM01039 | - | ![]() |
3634 | 0.00000000 | Harimatec Inc. | 370 | Spool | Obsolete | Wire Solder | 1.1 lbs (499 g) | - | - | - | - | download | RoHS non-compliant | Not Applicable | EAR99 | 8311.30.3000 | 20 | Sn62Pb38 (62/38) | Spool, 1 lb (454 g) | 0.032" (0.81mm) | 361°F (183°C) | Rosin Activated (RA) | 20 AWG, 21 SWG | Leaded | - | |||||
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WBRASAC20-1LB | 92.9900 | ![]() |
10 | 0.00000000 | SRA Soldering Products | - | Spool | Active | Wire Solder | - | - | - | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | 2260-WBRASAC20-1LB | EAR99 | 8311.30.6000 | 1 | - | Spool, 1 lb (453.59g) | 0.020" (0.51mm) | 423°F (217°C) | Rosin Activated (RA) | - | Lead Free | - | - | |||
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152985 | 48.9700 | ![]() |
54 | 0.00000000 | Kester Solder | ALPHA® | Box | Active | 6 Months | Date of Manufacture | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 117-152985 | EAR99 | 3810.10.0000 | 125 | Refrigerated | |||||||||||||
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BARSN42BI57AG1 | 54.0000 | ![]() |
13 | 0.00000000 | Chip Quik Inc. | Super Low Dross™ | Bulk | Active | Bar Solder | BARSN42 | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.90.0000 | 1 | Bi57Sn42Ag1 (57/42/1) | Bar, 1 lb (454g) | - | 280°F (138°C) | - | - | Lead Free | ||||||
RASWLF.015 1OZ | 8.0100 | ![]() |
2 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Wire Solder | RASW | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | RASWLF.0151OZ | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 1 oz (28.35g) | 0.015" (0.38mm) | 422 ~ 428°F (217 ~ 220°C) | Rosin Activated (RA) | 27 AWG, 28 SWG | Lead Free | ||||||||
SMD2SWLF.031 1OZ | 11.9200 | ![]() |
8 | 0.00000000 | Chip Quik Inc. | SMD2 | Bulk | Active | Wire Solder | SMD2S | - | - | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.90.0000 | 1 | Sn99.3Cu0.7 (99.3/0.7) | Spool, 1 oz (28.35g) | 0.031" (0.79mm) | 441°F (227°C) | No-Clean, Water Soluble | - | Lead Free | |||||
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4896-227G | 50.5400 | ![]() |
14 | 0.00000000 | MG Chemicals | 4890 | Spool | Active | Wire Solder | 4896 | 0.5 lb (226.8 g) | 60 Months | Date of Manufacture | - | - | download | RoHS non-compliant | Not Applicable | REACH Affected | EAR99 | 8311.30.3000 | 3 | Sn60Pb40 (60/40) | Spool, 8 oz (227g), 1/2 lb | 0.040" (1.02mm) | 361 ~ 376°F (183 ~ 191°C) | Rosin Activated (RA) | 18 AWG, 19 SWG | Leaded | - | |||
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70-1708-0520 | 44.0200 | ![]() |
20 | 0.00000000 | Kester Solder | R500 | Syringe | Active | Solder Paste | 70-1708 | 0.077 lb (34.93 g) | 6 Months | Date of Manufacture | 32°F ~ 50°F (0°C ~ 10°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | RoHS non-compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Syringe, 1.23 oz (35g), 10cc | - | 361°F (183°C) | Water Soluble | - | Leaded | Refrigerated | 3 | ||
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1354291 | 86.8280 | ![]() |
4246 | 0.00000000 | LOCTITE | WS300 | Bulk | Not For New Designs | Solder Paste | 6 Months | Date of Manufacture | 35.6°F ~ 46.4°F (2°C ~ 8°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | - | RoHS Compliant | Not Applicable | EAR99 | 8311.90.0000 | 10 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 17.64 oz (500g) | - | 423°F (217°C) | Water Soluble | - | Lead Free | - | ||||||
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23-6337-0018 | - | ![]() |
8960 | 0.00000000 | Kester Solder | 44 | Spool | Obsolete | Wire Solder | 0.5 lb (226.8 g) | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | Not Applicable | REACH Unaffected | KE1112 | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Spool, 8 oz (227g), 1/2 lb | 0.025" (0.64mm) | 361°F (183°C) | Rosin Activated (RA) | 22 AWG, 23 SWG | Leaded | ||||
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24-6337-9628 | - | ![]() |
3388 | 0.00000000 | Kester Solder | 285 | Bulk | Obsolete | Wire Solder | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.037" (0.94mm) | 361°F (183°C) | Rosin Mildly Activated (RMA) | 19 AWG, 20 SWG | Leaded | ||||||
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SMDSWLTLFP32 | 38.3100 | ![]() |
13 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Wire Solder | SMDSW | - | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 1 | Bi57Sn42Ag1 (57/42/1) | - | 0.030" (0.76mm) | 281°F (138°C) | - | 21 AWG, 22 SWG | Lead Free | - | |||||
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24-6337-7600 | 38.9557 | ![]() |
4275 | 0.00000000 | Kester Solder | 275 | Spool | Active | Wire Solder | 24-6337 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | download | RoHS non-compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.3000 | 25 | Sn63Pb37 (63/37) | Spool, 1 lb (454 g) | 0.031" (0.79mm) | 361°F (183°C) | No-Clean | 20 AWG, 22 SWG | Leaded | ||||||
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92-7150-8806 | - | ![]() |
9830 | 0.00000000 | Kester Solder | 245 | Bulk | Obsolete | Wire Solder | 92-7150 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Sn62Pb36Ag2 (62/36/2) | Spool, 17.64 oz (500g) | 0.015" (0.38mm) | 361°F (183°C) | No-Clean | 27 AWG, 28 SWG | Leaded | ||||||
SMD2SWLF.031 4OZ | 25.7200 | ![]() |
1722 | 0.00000000 | Chip Quik Inc. | SMD2 | Bulk | Active | Wire Solder | SMD2S | - | - | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.90.0000 | 1 | Sn99.3Cu0.7 (99.3/0.7) | Spool, 4 oz (113.40g) | 0.031" (0.79mm) | 441°F (227°C) | No-Clean, Water Soluble | - | Lead Free | |||||
24-6040-6411 | 36.9903 | ![]() |
5794 | 0.00000000 | Kester Solder | 331 | Spool | Active | Wire Solder | 24-6040 | 1 lb (453.59 g) | - | - | - | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | RoHS non-compliant | Not Applicable | REACH Unaffected | KE1304 | EAR99 | 8311.30.3000 | 25 | Sn60Pb40 (60/40) | Spool, 1 lb (454 g) | 0.062" (1.57mm) | 361 ~ 374°F (183 ~ 190°C) | Water Soluble | 14 AWG, 16 SWG | Leaded | ||||
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84-6337-0118 | - | ![]() |
8925 | 0.00000000 | Kester Solder | Solid Solder Wire | Bulk | Active | Wire Solder | 84-6337 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 1 | Sn63Pb37 (63/37) | Spool, 11.02 lbs (5kg) | 0.118" (3.00mm) | 361°F (183°C) | - | 9 AWG, 11 SWG | Leaded | |||||
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NC191LTA500C | 115.9000 | ![]() |
7163 | 0.00000000 | Chip Quik Inc. | Smooth Flow™ | Bulk | Active | Solder Paste | NC191 | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-NC191LTA500C | EAR99 | 8311.90.0000 | 1 | Bi57Sn42Ag1 (57/42/1) | Cartridge, 17.64 oz (500g) | - | 279°F (137°C) | No-Clean | - | - | 4 | ||||
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SMD3SW.031 1LB | 75.5400 | ![]() |
8951 | 0.00000000 | Chip Quik Inc. | SMD3 | Bulk | Active | Wire Solder | SMD3S | - | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Affected | EAR99 | 8311.30.3000 | 1 | Sn62Pb36Ag2 (62/36/2) | Spool, 1 lb (454 g) | 0.031" (0.79mm) | 354°F (179°C) | No-Clean, Water Soluble | 20 AWG, 22 SWG | Leaded | - | ||||
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90-7068-6422 | - | ![]() |
5205 | 0.00000000 | Kester Solder | 331 | Bulk | Active | Wire Solder | 90-7068 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 3.53 oz (100g) | 0.015" (0.38mm) | 423 ~ 424°F (217 ~ 218°C) | Water Soluble | 27 AWG, 28 SWG | Lead Free | |||||
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92-6337-8834 | - | ![]() |
3208 | 0.00000000 | Kester Solder | 245 | Bulk | Active | Wire Solder | 92-6337 | - | - | 50°F ~ 104°F (10°C ~ 40°C) | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.3000 | 1 | Sn63Pb37 (63/37) | Spool, 17.64 oz (500g) | 0.020" (0.51mm) | 361°F (183°C) | No-Clean | 24 AWG, 25 SWG | Leaded | |||||
04-6337-0000 | - | ![]() |
5959 | 0.00000000 | Kester Solder | E-Bar | Bulk | Obsolete | Bar Solder | 1.7 lbs (771.1 g) | - | - | - | - | download | RoHS non-compliant | Not Applicable | REACH Unaffected | KE1600 | EAR99 | 8311.30.3000 | 150 | Sn63Pb37 (63/37) | Bar, 1.66 lbs (750g) | - | 361°F (183°C) | - | - | Leaded | - | ||||
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04-7012-0000 | - | ![]() |
7086 | 0.00000000 | Kester Solder | E-Bar | Bulk | Obsolete | Bar Solder | 1.7 lbs (771.1 g) | - | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | KE1136 | EAR99 | 8311.30.6000 | 15 | Sn99.3Cu0.7 (99.3/0.7) | Bar, 1.66 lbs (750g) | - | 441°F (227°C) | - | - | Lead Free | - | |||
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44-7070-0000 | 137.7157 | ![]() |
7754 | 0.00000000 | Kester Solder | ULTRAPURE® | Bulk | Active | Bar Solder | 44-7070 | - | - | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.30.6000 | 25 | Sn95Ag5 (95/5) | Bar, 1.66 lbs (750g) | - | 430 ~ 473°F (221 ~ 245°C) | - | - | Lead Free | - | ||||
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TS391LT | 16.9500 | ![]() |
3184 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Solder Paste | TS391L | 12 Months | Date of Manufacture | 68°F ~ 77°F (20°C ~ 25°C) | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 3810.10.0000 | 1 | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Syringe, 0.53 oz (15g), 5cc | - | 281°F (138°C) | No-Clean | - | Lead Free | 4 | ||||
SMD2170 | 97.9500 | ![]() |
1387 | 0.00000000 | Chip Quik Inc. | SMD2 | Bulk | Active | Solder Sphere | - | 24 Months | Date of Manufacture | - | - | download | RoHS non-compliant | Not Applicable | REACH Affected | EAR99 | 8311.90.0000 | 1 | Sn63Pb37 (63/37) | Jar | 0.014" (0.36mm) | 361°F (183°C) | - | - | Leaded | ||||||
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4895-227G | 50.5400 | ![]() |
8 | 0.00000000 | MG Chemicals | 4890 | Spool | Active | Wire Solder | 4895 | 0.5 lb (226.8 g) | 60 Months | - | - | - | download | RoHS non-compliant | Not Applicable | REACH Affected | EAR99 | 8311.30.3000 | 3 | Sn60Pb40 (60/40) | Spool, 8 oz (227g), 1/2 lb | 0.032" (0.81mm) | 361 ~ 376°F (183 ~ 191°C) | Rosin Activated (RA) | 20 AWG, 21 SWG | Leaded | - | |||
RASWLF.031 8OZ | 56.9100 | ![]() |
6 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Wire Solder | RASW | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | RASWLF.0318OZ | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 8 oz (227g), 1/2 lb | 0.031" (0.79mm) | 422 ~ 428°F (217 ~ 220°C) | Rosin Activated (RA) | 21 AWG, 20 SWG | Lead Free | ||||||||
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412185 | - | ![]() |
6816 | 0.00000000 | Harimatec Inc. | C502 | Bulk | Obsolete | Wire Solder | - | - | 59°F ~ 86°F (15°C ~ 30°C) | download | RoHS non-compliant | Not Applicable | EAR99 | 8311.30.6000 | 20 | Spool, 8.8 oz (250g) | 0.022" (0.56mm) | No-Clean | 23 AWG, 24 SWG |
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