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Soldering, Desoldering, Rework Products(1194)
| Image | Product Number | Pricing(USD) | Quantity | ECAD | Quantity Available | Weight(Kg) | Mfr | Series | Package | Product Status | Type | Material | Base Product Number | Accessory Type | For Use With/Related Products | Thickness | Weight | Note | Shelf Life | Shelf Life Start | Storage/Refrigeration Temperature | Shipping Info | DataSheet | RoHS Status | Moisture Sensitivity Level (MSL) | REACH Status | Other Names | ECCN | HTSUS | Standard Package | Composition | Form | Pitch | Diameter | Number of Positions | Melting Point | Flux Type | Wire Gauge | Process | SIC Storage | Mesh Type | Inner Dimension | Outer Dimension | Thermal Center Pad |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
SMD291NL150G | 105.9500 |  |
1 | 0.00000000 | Chip Quik Inc. | CHIPQUIK® | Bulk | Active | Flux - No Clean, Lead Free, Tacky Solder | - | 24 Months | Date of Manufacture | 37°F ~ 77°F (3°C ~ 25°C) | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 3810.10.0000 | 1 | Jar, 5.29 oz (150g) | |||||||||||||||||||||
 |
SMD3SWLT.040 50G | 70.9500 | |
6128 | 0.00000000 | Chip Quik Inc. | SMD3 | Bulk | Active | Wire Solder | SMD3S | - | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-SMD3SWLT.04050G | EAR99 | 8311.30.6000 | 1 | Bi58Sn42 (58/42) | Spool, 1.8 oz (50g) | 0.040" (1.02mm) | 280°F (138°C) | No-Clean, Rosin Activated (RA) | - | Lead Free | |||||||||||||||
 |
SMDLTLFP10T5 | 32.9500 | |
4198 | 0.00000000 | Chip Quik Inc. | - | Syringe | Active | Solder Paste | SMDLTL | - | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 3810.10.0000 | 1 | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Syringe, 1.23 oz (35g), 10cc | - | 281°F (138°C) | No-Clean | - | Lead Free | Refrigerated | 5 | ||||||||||||
 |
FPC050P070-S | 11.5900 | |
7198 | 0.00000000 | Chip Quik Inc. | Proto-Advantage FPC | Bulk | Active | FPC/FFC | Stainless Steel | FPC050 | 0.0040" (0.102mm) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 7218.10.0000 | 1 | 0.020" (0.50mm) | 70 | - | 1.950" L x 0.900" W (49.53mm x 22.86mm) | 1.685" L x 0.157" W (42.80mm x 4.00mm) | |||||||||||||||||||
 |
RASW.020 4OZ | 10.8700 | |
4 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Wire Solder | RASW.020 | 60 Months | Date of Manufacture | download | RoHS non-compliant | Not Applicable | REACH Affected | RASW.0204OZ | EAR99 | 8311.30.6000 | 1 | Sn63Pb37 (63/37) | Spool, 4 oz (113.40g) | 0.020" (0.51mm) | 361°F (183°C) | Rosin Activated (RA) | 24 AWG, 25 SWG | Leaded | ||||||||||||||||
 |
SMDSWLF.059 3.3 1LB | 107.1900 | |
24 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Wire Solder | - | - | - | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-SMDSWLF.0593.31LB | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 1 lb (453.59g) | 0.059" (1.50mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | - | Lead Free | ||||||||||||||
 |
RASW.020 8OZ | 29.0600 | |
7 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Wire Solder | RASW.020 | - | download | RoHS non-compliant | Not Applicable | REACH Affected | RASW.0208OZ | EAR99 | 8311.30.6000 | 1 | Sn63Pb37 (63/37) | Spool, 8 oz (227g), 1/2 lb | 0.020" (0.51mm) | 361°F (183°C) | Rosin Activated (RA) | 24 AWG, 25 SWG | Leaded | |||||||||||||||||
 |
SMD2032 | 122.9500 | |
1 | 0.00000000 | Chip Quik Inc. | SMD2 | Bulk | Active | Solder Sphere | - | 24 Months | Date of Manufacture | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.90.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar | 0.016" (0.40mm) | 423 ~ 428°F (217 ~ 220°C) | - | - | Lead Free | |||||||||||||||
 |
SMD4300AX250T3 | 42.9500 | |
4 | 0.00000000 | Chip Quik Inc. | CHIPQUIK® SMD4300 | Jar | Active | Solder Paste | SMD4300 | 0.551 lb (249.93 g) | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Sn63Pb37 (63/37) | Jar, 8.8 oz (250g) | - | 361°F (183°C) | No-Clean, Water Soluble | - | Leaded | Refrigerated | 3 | ||||||||||||
 |
GEN-DR100-P40-S | 20.9900 | |
4821 | 0.00000000 | Chip Quik Inc. | Proto-Advantage GEN | Bulk | Active | - | Stainless Steel | GEN-D | - | - | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 7326.90.8688 | 1 | 0.039" (1.00mm) | 40 | - | - | - | |||||||||||||||||||
 |
PA0109-S | 11.5900 | |
1 | 0.00000000 | Chip Quik Inc. | Proto-Advantage PA | Bulk | Active | TQFP | Stainless Steel | 0.0040" (0.102mm) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 7218.10.0000 | 1 | 0.020" (0.50mm) | 100 | 0.551" L x 0.551" W (14.00mm x 14.00mm) | 1.300" L x 0.900" W (33.02mm x 22.86mm) | - | ||||||||||||||||||||
|
IPC0139-S | 12.9300 | |
6221 | 0.00000000 | Chip Quik Inc. | Proto-Advantage IPC | Bulk | Active | TQFP | Stainless Steel | 0.0040" (0.102mm) | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8515.19.0000 | 1 | 0.031" (0.80mm) | 80 | 0.787" L x 0.551" W (20.00mm x 14.00mm) | 1.300" L x 0.900" W (33.02mm x 22.86mm) | - | ||||||||||||||||||||
 |
CQ9LF-B-R | 13.5600 | |
4 | 0.00000000 | Chip Quik Inc. | CHIPQUIK® | Bulk | Active | Flux - Rosin Mildly Activated (RMA), No Clean, Liquid | 24 Months | Date of Manufacture | 37°F ~ 77°F (3°C ~ 25°C) | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 315-CQ9LF-B-R | EAR99 | 3810.10.0000 | 1 | Pen, 0.2 oz (5.669g) | |||||||||||||||||||||
 |
IPC0144-S | 11.5900 | |
4241 | 0.00000000 | Chip Quik Inc. | Proto-Advantage IPC | Bulk | Active | QFN/LFCSP | Stainless Steel | 0.0040" (0.102mm) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 7218.10.0000 | 1 | 0.016" (0.40mm) | 56 | 0.276" L x 0.276" W (7.00mm x 7.00mm) | 1.300" L x 0.900" W (33.02mm x 22.86mm) | 0.204" L x 0.204" W (5.18mm x 5.18mm) | ||||||||||||||||||||
 |
SMD291SNL500T3C | 108.7500 | |
4487 | 0.00000000 | Chip Quik Inc. | - | Cartridge | Active | Solder Paste | SMD291 | 6 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | Ships with Cold Pack. To ensure customer satisfaction and product integrity, air shipment is recommended. | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 3810.10.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Cartridge, 17.64 oz (500g) | - | 423 ~ 428°F (217 ~ 220°C) | No-Clean | - | Lead Free | Refrigerated | 3 | |||||||||||||
 |
PA0183-S | 11.5900 | |
7068 | 0.00000000 | Chip Quik Inc. | Proto-Advantage PA | Bulk | Active | TO/DPAK | Stainless Steel | 0.0040" (0.102mm) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 7218.10.0000 | 1 | 0.090" (2.29mm) | 3 | 0.287" L x 0.259" W (7.30mm x 6.58mm) | 1.300" L x 0.900" W (33.02mm x 22.86mm) | 0.276" L x 0.236" W (7.00mm x 6.00mm) | ||||||||||||||||||||
 |
SMD2195 | 83.9500 | |
2 | 0.00000000 | Chip Quik Inc. | SMD2 | Bulk | Active | Solder Sphere | - | 24 Months | Date of Manufacture | - | - | download | RoHS non-compliant | Not Applicable | REACH Affected | EAR99 | 8311.90.0000 | 1 | Sn63Pb37 (63/37) | Jar | 0.022" (0.56mm) | 361°F (183°C) | - | - | Leaded | |||||||||||||||
 |
CQ2LF-128 | 245.9500 | |
2643 | 0.00000000 | Chip Quik Inc. | CHIPQUIK® | Bulk | Active | Flux - Rosin Activated (RA), Lead Free, Water-Soluble, Liquid | CQ2LF | 24 Months | Date of Manufacture | 37°F ~ 77°F (3°C ~ 25°C) | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 3810.10.0000 | 1 | Jug, 128 oz (3.62kg) | ||||||||||||||||||||||
 |
NC191LTA250 | 57.9500 | |
8544 | 0.00000000 | Chip Quik Inc. | Smooth Flow™ | Bulk | Active | Solder Paste | NC191 | 12 Months | Date of Manufacture | 37°F ~ 46°F (3°C ~ 8°C) | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-NC191LTA250 | EAR99 | 3810.10.0000 | 1 | Bi57Sn42Ag1 (57/42/1) | Jar, 8.8 oz (250g) | - | 279°F (137°C) | No-Clean | - | - | 4 | ||||||||||||||
 |
GA100-50G | 73.3000 | |
2 | 0.00000000 | Chip Quik Inc. | CHIPQUIK® | Bulk | Active | Solder Paste | - | - | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 315-GA100-50G | EAR99 | 8112.99.9100 | 1 | Ga100 | Syringe, 1.8 oz (51.029g) | - | 85.57°F (29.76°C) | - | - | - | - | |||||||||||||
 |
SMD2060 | 108.9500 | |
6098 | 0.00000000 | Chip Quik Inc. | SMD2 | Bulk | Active | Solder Sphere | 24 Months | Date of Manufacture | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.3000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar | 0.030" (0.76mm) | 423 ~ 428°F (217 ~ 220°C) | - | - | Lead Free | - | ||||||||||||||||
 |
SMDSWLF.020 1LB | 95.6700 | |
3 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Wire Solder | SMDSW | - | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 1 lb (454 g) | 0.020" (0.51mm) | 423 ~ 428°F (217 ~ 220°C) | No-Clean, Water Soluble | 24 AWG, 25 SWG | Lead Free | - | ||||||||||||||
 |
BARSN42BI57AG1-8OZ | 29.0000 | |
3 | 0.00000000 | Chip Quik Inc. | Super Low Dross™ | Bulk | Active | Bar Solder | BARSN42 | - | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | EAR99 | 8311.90.0000 | 1 | Bi57Sn42Ag1 (57/42/1) | Bar, 0.5 lb (227g) | - | 280°F (138°C) | - | - | Lead Free | ||||||||||||||||
 |
SMDSN60BI40 | 19.9500 | |
2919 | 0.00000000 | Chip Quik Inc. | CHIPQUIK® | Bulk | Active | Wire Solder | - | 60 Months | Date of Manufacture | - | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | 315-SMDSN60BI40 | EAR99 | 8311.30.6000 | 1 | Sn60Bi40 (60/40) | Spool | 0.031" (0.79mm) | 280°F ~ 338°F (138°C ~ 170°C) | - | - | Lead Free | ||||||||||||||
 |
REM8 | 47.1700 | |
1 | 0.00000000 | Chip Quik Inc. | CHIPQUIK® | Bulk | Active | Removal Alloy | SMD Components | - | - | - | download | RoHS non-compliant | 1 (Unlimited) | REACH Affected | 315-REM8 | EAR99 | 8311.90.0000 | 1 | ||||||||||||||||||||||
 |
RASWLF.015 1LB | 96.9500 | |
6411 | 0.00000000 | Chip Quik Inc. | - | Bulk | Active | Wire Solder | RASW | - | download | ROHS3 Compliant | Not Applicable | REACH Unaffected | RASWLF.0151LB | EAR99 | 8311.30.6000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 1 lb (454 g) | 0.015" (0.38mm) | 422 ~ 428°F (217 ~ 220°C) | Rosin Activated (RA) | 27 AWG, 28 SWG | Lead Free | |||||||||||||||||
 |
NDR050P080-S | 11.5900 | |
2461 | 0.00000000 | Chip Quik Inc. | Proto-Advantage NDR | Bulk | Active | - | Stainless Steel | NDR050 | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-NDR050P080-S | EAR99 | 7326.90.8688 | 1 | 0.020" (0.50mm) | 80 | - | - | - | ||||||||||||||||||
 |
EXB-SN96.5AG3.0CU0.5-0.5LB | 34.4400 | |
60 | 0.00000000 | Chip Quik Inc. | Super Low Dross™ | Bulk | Active | Bar Solder | EXB-SN96 | - | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | 315-EXB-SN96.5AG3.0CU0.5-0.5LB | EAR99 | 8311.90.0000 | 1 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Bar, 0.5 lb (227g) | - | 423 ~ 428°F (217 ~ 220°C) | - | - | Leaded | |||||||||||||||
 |
SMD2195-25000 | 16.7900 | |
13 | 0.00000000 | Chip Quik Inc. | SMD2 | Bulk | Active | Solder Sphere | - | 24 Months | Date of Manufacture | - | - | download | RoHS non-compliant | Not Applicable | REACH Affected | EAR99 | 8311.90.0000 | 1 | Sn63Pb37 (63/37) | Jar | 0.022" (0.56mm) | 361°F (183°C) | - | - | Leaded | |||||||||||||||
 |
SMDIN100 | 19.9500 | |
4579 | 0.00000000 | Chip Quik Inc. | SMD | Bulk | Active | Wire Solder | SMDIN | - | - | - | - | download | ROHS3 Compliant | 1 (Unlimited) | REACH Unaffected | EAR99 | 8311.90.0000 | 1 | In100 (100) | Spool | 0.031" (0.79mm) | 315°F (157°C) | - | 20 AWG, 21 SWG | Lead Free | - |
2000+
Daily average RFQ Volume
30,000,000
Standard Product Unit
2800+
Worldwide Manufacturers
15,000 m2
In-stock Warehouse
Wishlist (0 Items)